Description
Product Description
High-Precision Desktop Grinding & Polishing Machine
Designed for precision grinding, finishing, and polishing of semiconductor, optical, fiber-optic, and micro-mechanical components, this compact desktop machine provides high-speed operation and precise rotational stability in a small laboratory-friendly format.
With an adjustable speed range of 1,000–10,000 RPM, the machine can accommodate different materials and processing requirements. Its precision spindle is designed for low runout, with radial runout ≤1 μm and axial runout ≤3 μm, making it suitable for demanding small-scale grinding and polishing applications.
The included abrasive accessories provide multiple stages of surface finishing, from initial material removal to fine polishing.
Key Features
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High-Speed Adjustable Operation – Speed range from 1,000 to 10,000 RPM.
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High Precision Spindle – Radial runout ≤ 1 μm and axial runout ≤ 3 μm.
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Multi-Stage Grinding & Polishing – Supports coarse, intermediate, and fine finishing.
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Compact Desktop Design – Suitable for laboratories, workshops, optical benches, and precision workstations.
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Wide Material Compatibility – Suitable for silicon, quartz, sapphire, optical fibers, and other small precision components.
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Precision Optical Processing – Designed for optical fiber end-face preparation and micro-optical component finishing.
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Multiple Abrasive Grades Included – Includes 30 μm, 9 μm, 3 μm, and 1 μm polishing accessories.
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Stable High-Speed Operation – Designed to maintain consistent rotational performance during precision processing.
Materials & Components
Suitable for processing applications involving:
- Silicon wafers
- Quartz
- Sapphire
- Optical fibers
- Polarization-maintaining fibers
- Optical waveguide chips
- Micro optical components
- Precision cutting tools
- Drill bits
- Probe tips
Applications
🔬 Optical & Photonics
- Optical fiber end-face grinding and polishing
- PM fiber end-face preparation
- Optical waveguide chip end-face polishing
- Fiber-to-chip coupling preparation
- Precision finishing of micro-optical components
🧪 Semiconductor & Materials
- Silicon wafer processing
- Quartz and sapphire sample preparation
- Small semiconductor component finishing
- Precision material surface preparation
🛠️ Precision Machining
- Cutting tool grinding and polishing
- Drill bit sharpening and finishing
- Precision micro-tool processing
- Fine grinding of small components
📡 Probe & Sensor Development
- Probe tip grinding
- High/low-temperature probe preparation
- Precision sensor component finishing
Included Polishing Accessories
The standard package includes polishing/abrasive accessories in multiple grades:
30 μm → 9 μm → 3 μm → 1 μm
This allows users to progressively reduce surface roughness from material removal to fine finishing.
Technical Specifications
| Specification |
Details |
| Machine Type |
Desktop precision grinding & polishing machine |
| Speed Range |
1,000–10,000 RPM |
| Radial Runout |
≤1 μm |
| Axial Runout |
≤3 μm |
| Included Abrasive Grades |
30 / 9 / 3 / 1 μm |
| Materials |
Silicon, quartz, sapphire, optical fiber, etc. |
| Application |
Grinding, polishing, precision finishing |
Precision Processing in a Compact Desktop Platform
From optical fiber end-face polishing and waveguide preparation to silicon, sapphire, quartz, and precision micro-component processing, this machine provides a flexible platform for laboratories, engineers, researchers, and precision machining applications.
High speed. Low runout. Multi-stage polishing. Built for precision optical and micro-component processing.
Note: Actual achievable surface roughness, dimensional accuracy, and polishing quality depend on the material, abrasive, fixture, processing pressure, speed, and polishing procedure. The stated runout values should be verified against the manufacturer's measurement conditions.
